Layer: 4L ;

Material: FR4 TG170;

Finished thickness: 1.6mm

Copper thickness: 1/H/H/1 OZ

Surface treatment: Electroless Nickel Immersion Gold (ENIG);

Solder mask color: Green;

Min.Width/Space ：8.0mil/8.0mil;

Min. hole size: 0.1mm

Application: Telecommunication/Data Center

(1+N+1, Blind via, Buried via, Half Hole/Edge Plated)

Layer: 6L ;

Material: FR4 TG150;

Finished thickness: 1.6mm

Copper thickness: 2/2/2/2/2/2 OZ

Surface treatment: Electroless Nickel Immersion Gold (ENIG);

Solder mask color: Green;

Min.Width/Space ：8.0mil/8.0mil;

Min. hole size: 0.1mm

Application: Telecommunication/Data Center

(1+N+1, Blind via, Buried via, Heavy Copper)

Layer: 10L ;

Material: FR4 TG170;

Finished thickness: 1.6mm

Copper thickness: 1/1/1/1/1/1/1/1/1/1 OZ

Surface treatment: Electroless Nickel Immersion Gold (ENIG);

Solder mask color: Green;

Min.Width/Space ：6.0mil/6.0mil;

Min. hole size: 0.1mm

Application: Medical

(1+N+1, Blind via, Buried via)