Layer: 2L;

Material: FR4;

Finished thickness: 1.6mm

Copper thickness: 1/1 OZ

Surface treatment: Electroless Nickel Immersion Gold (ENIG);

Solder mask color: Green;

Min.Width/Space ：4.0mil/4.0mil;

Min. hole size: 0.25mm

Application: Industrial

Layer: 4L;

Material: FR4;

Finished thickness: 1.6mm

Copper thickness: 1/1/1/1 OZ

Surface treatment: Electroless Nickel Immersion Gold (ENIG);

Solder mask color: Black;

Min.Width/Space ：4.0mil/4.0mil;

Min. hole size: 0.3mm

Application: Automotive

Immersion Gold on the all bottom layer

Layer: 6L;

Material: FR4;

Finished thickness: 1.6mm

Copper thickness: 2/3/3/3/3/2OZ

Surface treatment: ENIG;

Solder mask color: Green;

Min.Width/Space ：4.0mil/4.0mil;

Min. hole size: 0.2mm;

Application: Power Supply;

(Edge Plated, Heavy Copper)

Layer: 8L;

Material: FR4;

Finished thickness: 1.6mm

Copper thickness: 1/H/H/H/H/H/H/1 OZ

Surface treatment: Electroless Nickel Immersion Gold (ENIG);

Solder mask color: Back;

Min.Width/Space ：6.0mil/6.0mil;

Min. hole size: 0.3mm

Application: Power Supply

(Impedance Control;)

Layer: 10L;

Material: FR4;

Finished thickness: 1.6mm

Copper thickness: 1/H/H/H/H/H/H/H/H/1 OZ

Surface treatment: Electroless Nickel Immersion Gold (ENIG);

Solder mask color: Blue;

Min.Width/Space ：6.0mil/6.0mil;

Min. hole size: 0.3mm;

Application: Data Center;

(Edge Plated; Half Hole;)

Layer: 12L;

Material: FR4;

Finished thickness: 1.6mm

Copper thickness: 1/H/H/H/H/H/H/H/H/H/H/1 OZ

Surface treatment: Electroless Nickel Immersion Gold (ENIG);

Solder mask color: Green;

Min.Width/Space ：8.0mil/8.0mil;

Min. hole size: 0.3mm;

Application: Medical;

(Impedance Control, Hard Gold/ Gold Finger)