Layer: 2 layer;

Material: PI (Dupond)

Finished thickness: 0.2mm

Copper thickness: 1/1 OZ

Surface treatment: Electroless Nickel Immersion Gold (ENIG);

Solder mask color: Yellow film;

Min.Width/Space ：6.0mil/6.0mil;

Min. hole size: 0.25mm

Application: Consuming Industry

Layer: 2 layer;

Material: PI (Dupond)+FR4

Finished thickness: 1.13mm

Copper thickness: 1/1 OZ

Surface treatment: Electroless Nickel Immersion Gold (ENIG);

Solder mask color: Yellow film;

Min.Width/Space ：6.0mil/6.0mil;

Min. hole size: 0.25mm

Application: Consuming Industry

Stiffener:   0.23mm thickness of PI and 0.9mm thickness of FR4 on each end of the PCB.