Layer: 8 layer for rigid, 2L for flex part;
Material: FR4 TG150 + PI
Finished thickness: 1.6mm
Copper thickness: 1/H/H/H/H/H/H/1 OZ
Surface treatment: Electroless Nickel Immersion Gold (ENIG);
Solder mask color: Green; Yellow film;
Min.Width/Space :4.0mil/4.0mil;
Min. hole size: 0.25mm
Application: Telecommunication
(Edge plated, Impedance Control)