Item

Capability

Layer count

1-32L

Final board thickness

0.15-6mm

Aspect ratio

15:01

Copper thickness

12oz

Impedance

Single line

+/-7%

Differential line

+/-7%

Line/space

Inner layer   

2.0/2.0mil

Outer layer

2.5/2.5mil

                              Min hole size                                                                                       

4mil

Min laser hole size

3mil

Hole position tolerance

+/-3mil

PTH hole dimension tolerance

+/-2mil

NPTH hole dimension tolerance

+/-1mil

Solder mask

Line to solder PAD

3mil

Registration tolerance

+/-1.5mil

Peelable mask thickness

8-32mil

         Carbon   ink thickness

0.8-2mil

     HAL/LF HAL   thickness

SMD:40-2000u”

GND:30-800u”

Immersion Au   

Au THK

1-5u”

Ni   THK

80-200u”

Immersion tin

0.8-1.2um

Gold finger

Au THK

10-80u”

Ni THK

120-600u”

Routing

+/-2mil

Lamination Type

Standard FR4/Flex/Rigid-Flex

High-speed(56G+)

Metal-Core material

RF/PTFE Material

EC/ER/EI/Ceramic